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| Principle of
Operation |
autofocus sensor |
white light sensor |
confocal sensor
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confocal sensor |
| Measurement
range |
1500 µm |
300 µm (500 µm with reduced
specifications) |
1000 µm |
1000 µm |
| Resolution |
10 nm |
25 nm |
20 nm |
20 nm |
| Straightness
deviation |
200 nm |
1.5 µm |
1 µm |
2 µm |
| Reproducibility |
standard deviation <= 10 nm
(1) |
standard deviation<= 10 nm
(2) |
standard deviation<= 15 nm
(3) |
standard deviation<= 15 nm
(3) |
| Stand off |
2 mm |
4 mm |
4 mm |
13.5 mm |
| Light source |
class 1 laser, 780 nm |
tungsten halogen lamp 55W |
class 2 laser (670 nm) |
class 1 laser (780 nm) |
| Spot diameter |
1.9 µm |
5 µm |
1.7 µm |
2 µm |
| Maximum surface
tilt (4) |
90° +/- 25° |
90° +/- 25° |
90° +/- 25° |
90° +/- 25° |
| Sampling frequency |
16 Hz - 10 kHz |
30 Hz to 1500 Hz, dependent on
the reflectivity of the surface |
16 Hz - 1000 Hz |
16 Hz - 1000 Hz |
| Data output |
RS232 |
RS232, analogue output 0-10V |
RS232, analogue output 0-10V |
RS232, analogue output
0-10V |
| Features |
- integrated bright field microscope
- integrated incremental encoder (glass scale),
no periodic re-calibration required
- unique combination of resolution, measurement
range and straightness deviation
- integrated trigger module
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- miniature sensor, Ø12mm x 110 mm
- passive sensor without any moving parts
- measurement spot diameter similar to mechanical
sensors
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- integrated trigger module
- dynamical range 5000:1
- easy operation, no sensor parameter selection
necessary
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- integrated trigger module
- dynamical range 5000:1
- easy operation, no sensor parameter selection
necessary
- large stand off
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| Applications |
- thick film and hybrids
- optics, telecommunication, electrical
engineering, electronics industry
- material testing, tribology
- mechanical engineering (form, flatness,
waviness, roughness)
- IC packaging (warpage, coplanarity, bump height
and volume)
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- micro mechanics
- optics, telecommunication, electrical
engineering, electronics industry
- plastics and paper industry
- IC packaging (warpage, coplanarity, bump height
and volume)
- inspection on thick film, hybrid or pcb boards
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- micromechanical engineering
- electrical engineering, optics, thick film and
hybrids, electronics industry
- plastics and paper industry
- IC packaging (warpage, coplanarity, bump height
and volume)
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- micromechanical engineering
- electrical engineering, optics, thick film and
hybrids, electronics industry
- plastics and paper industry
- IC packaging (warpage, coplanarity, bump height
and volume)
- tool industry, mechanical engineering
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1) 50 measurements on a step
standard of 150 µm
2) 50 measurements on a step standard of 200 µm
3) 50 measurements on a step standard of 504 µm
4 ) on a
polished surface, more on diffuse reflecting surfaces |
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